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Background

Bahgat Sammakia is a SUNY Distinguished Professor of Mechanical Engineering at �����о�Ժ����. He is also the founding director of S3IP, a New York State Center of Excellence at �����о�Ժ����, and the director of the NSF I/UCRC for Energy-Smart Electronic Systems (ES2).

His research covers several broad areas, including energy optimization in data centers, electronics systems integration and packaging, flexible electronics, and thermal management of electronic devices and systems.

Sammakia is a fellow of the American Society of Mechanical Engineers, the National Academy of Inventors and the IEEE. He also is a recipient of the SUNY Chancellor’s Award for Excellence in Scholarship and Creative Activities. He was honored with the 2010 ITherm Achievement Award for his contributions to the field of semiconductor thermal management as well as the ASME Heat Transfer Memorial Award in 2020.

Professional Appointments

• 2011-August 2025: Vice President for Research, �����о�Ժ����
• November 2016 to June 2018: SUNY Polytechnic Institute – Interim President
• 2003���������Գ�: Founding Director of the New York Center of Excellence for Small Scale Systems Integration and Packaging (S3IP)
• 2011���������Գ�: Director of the NSF I/UCRC for Energy-Smart Electronic Systems (ES2)
• 1998-Present: Distinguished Professor of Mechanical Engineering, �����о�Ժ����
• 1984-98: IBM Corporation, Microelectronics Division, Senior Technical Staff Member (STSM) and manager of organic electronics packaging R&D

Selected Publications

(over 350 total, including 40 patents)

1. Gebhart, B., Jaluria, Y., Mahajan, R.L., Sammakia, B. and Yovanovich, M.M., 1989. Buoyancy-induced flows and transport.
2. Alissa, Husam A., Kourosh Nemati, Bahgat G. Sammakia, Mark J. Seymour, Russell Tipton, David Mendo, Dustin W. Demetriou, and Ken Schneebeli. "Chip to Chiller Experimental Cooling Failure Analysis of Data Centers: The Interaction Between IT and Facility." IEEE Transactions on Components, Packaging and Manufacturing Technology 6, no. 9 (2016): 1361-1378.
3. Alissa, Husam A., Kourosh Nemati, Bahgat G. Sammakia, Ken Schneebeli, Roger R. Schmidt, and Mark J. Seymour. "Chip to Facility Ramifications of Containment Solution on IT Airflow and Uptime." IEEE Transactions on Components, Packaging and Manufacturing Technology 6, no. 1 (2016): 67-78.
4. Alkharabsheh, S. A., Sammakia, B.G., & Shrivastava, S. K. (2015). “Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment.” Journal of Electronic Packaging, 137(2), 021010.
5. Gao, T., Sammakia, B., Samadiani, E., & Schmidt, R. (2015). “Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers.” Journal of Electronic Packaging, 137(2), 021007.
6. Gao, Tianyi, Bruce Murray, and Bahgat Sammakia. "Analysis of Transient and Hysteresis Behavior of Cross-flow Heat Exchangers under Variable Fluid Mass Flow Rate for Data Center Cooling Applications." Applied Thermal Engineering (2015).
7. Iyengar, M., Geisler, K.J.L., and Sammakia, B., (2014) “Cooling of Microelectronic and Nanoelectronic Equipment, Advances and Emerging Research”, World Scientific, WSPC Series in Advanced Integration and Packaging, Vol. 3. (Book)
8. Song, Z., Murray B., and Sammakia B. (2014). "Numerical investigation of inter-zonal boundary conditions for data center thermal analysis." International Journal of Heat and Mass Transfer 68: 649-658.
9. Joshi, Y., Pramod K., Sammakia, B., and Patterson, M. (2012), Energy Efficient Thermal Management of Data Centers. New York: Springer, (Book)
10. Alissa, Husam A., Kourosh Nemati, Bahgat G. Sammakia, Ken Schneebeli, Roger R. Schmidt, and Mark J. Seymour. "Chip to Facility Ramifications of Containment Solution on IT Airflow and Uptime." IEEE Transactions on Components, Packaging and Manufacturing Technology 6, no. 1 (2016): 67-78.
11. Gao, Tianyi, Bahgat Sammakia, and James Geer. "Dynamic response and control analysis of cross flow heat exchangers under variable temperature and flow rate conditions." International Journal of Heat and Mass Transfer 81 (2015): 542-55

Over 10,000 citations total, h=46 according to Google Scholar

Synergistic Activities

• Fellow of the ASME, the IEEE and the NAI
• Editor in chief of the Journal of Electronic Packaging, Trans. of the ASME 2001-2013.
• Associate editor IEEE Transactions on components and packaging technologies (CPT).
• General chair ITherm 2006, Intersociety conference on Thermal Management of Electronic Equipment.
• Fellow of three International Societies: IEEE, ASME, NAI.
• Holder of 27 U.S. patents in the areas of electronic packaging and thermal management.
• Member of the Board of Directors of the Research Foundation of the State University of New York.

Google Scholar

Education

• BS, University of Alexandria – Alexandria, Egypt
• MS and PhD, University at Buffalo - Buffalo, N.Y.
• Postdoctoral Fellow, University of Pennsylvania - Philadelphia, Pa.

Research Interests

• Heat transfer
• Electronics packaging
• Thermal management of data centers
• Heterogeneous integration research

Awards

• Received the 2020 Heat Transfer Memorial Art Award by The American Society of Mechanical Engineers (ASME). The Heat Transfer Memorial Award is bestowed on individuals who have made outstanding contributions to the field of heat transfer through teaching, research, practice, design, service, leadership, inventions or a combination of such activities.  
• Received the Outstanding paper award for the 2024 Interpack  conference, “Advancing in Data Centers Thermal Management Experimental Assessment of Two Phase Liquid Cooling Technology," San Jose CA. 
• 2019 Best Student Paper Award, IEEE SEMI-THERM Conference, San Jose, CA. Khalili, S., Mohsenian, G, Desu, A., Ghose, K, Sammakia, B., 2019, "Airflow Management Using Active Air Dampers in Presence of a Dynamic Workload in Data Centers," 2019, IEEE SEMI-THERM.
• 2018 Outstanding paper award, ASME Electronic and Photonic Packaging Division, for the paper “Impact of internal design on the efficiency of IT equipment in a hot aisle containment system; An experimental study,” Khalili, S., Alissa, H., Nemati, K., Seymour, M., Curtis, R., Moss, D., & Sammakia, B. (2018 published at the ASME 2018 InterPACK Conference, San Francisco, CA.   
• 2016 Best Paper Award -- IEEE Transactions on Components, Packaging and Manufacturing Technology – Components Journal (TCPMT): Characterization and Modeling. "Chip to Facility Ramifications of Containment Solution on IT Airflow and Uptime," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.PP, no.99, pp.1-12, 2016.